sfh 4253 ir-lumineszenzdiode (850 nm) mit hoher ausgangsleistung high power infrared emitter (850 nm) lead (pb) free produc t - rohs compliant 2009-08-25 1 wesentliche merkmale ? infrarot led mit hoher ausgangsleistung ? kurze schaltzeiten anwendungen ? infrarotbeleuchtung fr kameras ? ir-datenbertragung ? sensorik sicherheitshinweise je nach betriebsart emi ttieren diese bauteile hochkonzentrierte, nicht sichtbare infrarot- strahlung, die gef?hrlich fr das menschliche auge sein kann. produkte, die diese bauteile enthalten, mssen gem?? den sicherheits- richtlinien der iec-normen 60825-1 und 62471 behandelt werden. typ type bestellnummer ordering code strahlst?rkegruppierung 1) ( i f = 70 ma, t p = 20 ms) radiant intensity grouping 1) i e (mw/sr) sfh 4253 q65110a6657 4 (typ. 11) 1) gemessen bei einem raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr features ? high power infrared led ? short switching times applications ? infrared illumination for cameras ? ir data transmission ? optical sensors safety advices depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. products which incorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471.
2009-08-25 2 sfh 4253 grenzwerte ( t a = 25 c) maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op , t stg ? 40 + 100 c sperrspannung reverse voltage v r 5 v vorw?rtsgleichstrom forward current i f 70 ma sto?strom, t p = 100 s, d = 0 surge current i fsm 700 ma verlustleistung power dissipation p tot 140 mw w?rmewiderstand sperrschicht - umgebung bei montage auf fr4 platine, padgr??e je 16 mm 2 thermal resistance junction - ambient mounted on pc-board (fr4), padsize 16 mm 2 each w?rmewiderstand sperrschicht - l?tstelle bei montage auf metall-block thermal resistance junc tion - soldering point, mounted on metal block r thja r thjs 500 280 k/w k/w kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 70 ma peak 860 nm centroid-wellenl?nge der strahlung centroid wavelength i f = 70 ma centroid 850 nm spektrale bandbreite bei 50% von i max spectral bandwidth at 50% of i max i f = 70 ma ? 42 nm abstrahlwinkel half angle ? 60 grad deg. aktive chipfl?che active chip area a 0.04 mm 2
sfh 4253 2009-08-25 3 abmessungen der aktiven chipfl?che dimension of the active chip area l b l w 0.2 0.2 mm2 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, bei i f = 70 ma, r l = 50 switching times, e from 10% to 90% and from 90% to 10%, i f = 70 ma, r l = 50 t r , t f 10 ns durchlassspannung forward voltage i f = 70 ma, t p = 20 ms i f = 500 ma, t p = 100 s v f v f 1.6 (< 2.0) 2.4 (< 3.0) v v sperrstrom reverse current i r not designed for reverse operation a gesamtstrahlungsfluss total radiant flux i f = 70 ma, t p = 20 ms e typ 33 mw temperaturkoeffizient von i e bzw. e , i f = 70 ma temperature coefficient of i e or e , i f = 70 ma tc i ? 0.5 %/k temperaturkoeffizient von v f , i f = 70ma temperature coefficient of v f , i f = 70 ma tc v ? 0.7 mv/k temperaturkoeffizient von , i f = 70 ma temperature coefficient of , i f = 70 ma tc + 0.3 nm/k kennwerte ( t a = 25 c) characteristics (cont?d) bezeichnung parameter symbol symbol wert value einheit unit
2009-08-25 4 sfh 4253 abstrahlcharakteristik radiation characteristics i rel = f ( ? ) strahlst?rke i e in achsrichtung 1) gemessen bei einem raumwinkel = 0.01 sr radiant intensity i e in axial direction at a solid angle of = 0.01 sr bezeichnung parameter symbol werte values einheit unit sfh 4253-p sfh 4253-q sfh 4253-r strahlst?rke radiant intensity i f = 70 ma, t p = 20 ms i e min i e max 4 8 6.3 12.5 10 20 mw/sr mw/sr strahlst?rke radiant intensity i f = 500 ma, t p = 25 s i e typ 23 36 55 mw/sr 1) nur eine gruppe in einer verpackungs einheit (streuung kleiner 2:1) / only one bin in one packing unit (variation lower 2:1) 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
sfh 4253 2009-08-25 5 relative spectral emission i rel = f ( ) forward current i f = f ( v f ) single pulse, t p = 100 s 700 0 nm % ohf04135 20 40 60 80 100 950 750 800 850 i rel ohf03826 f i 10 -4 0.5 1 1.5 2 2.5 v3 10 0 a 0 f v -1 10 5 5 10 -2 -3 5 10 radiant intensity single pulse, t p = 25 s permissible pulse handling capability i f = f ( ), t a = 25 c, duty cycle d = parameter i e i e 70 ma = f ( i f ) ohf03825 10 -3 ma 0 10 5 10 -1 -2 5 10 i f 0 10 1 10 2 10 3 10 55 5 1 10 (70 ma) e e i i 0 -5 f i a t p s ohf03733 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 10 t t t d = p p t i f 0.05 0.5 0.1 0.3 0.005 0.01 0.02 = d 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1 max. permissible forward current i f = f ( t a ), r thja = 500 k/w permissible pulse handling capability i f = f ( ), t a = 85 c, duty cycle d = parameter 0 0 ?c t i f ma ohf03732 a 20 40 60 80 100 120 10 20 30 40 50 60 70 80 0 -5 f i a t p s ohf03824 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 10 t t t d = p p t i f 0.05 0.5 0.1 0.3 0.005 0.01 0.02 = d 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1
2009-08-25 6 sfh 4253 ma?zeichnung package outlines ma?e in mm (inch) / dimensions in mm (inch). geh?use / package topled ? , klarer verguss / topled ? , clear resin anschlussbelegung pin configuration siehe zeichnung see drawing gply6724 0.7 (0.028) 0.9 (0.035) 1.7 (0.067) 2.1 (0.083) 0.12 (0.005) 0.18 (0.007) 0.5 (0.020) 1.1 (0.043) 3.3 (0.130) 3.7 (0.146) 0.4 (0.016) 0.6 (0.024) 2.6 (0.102) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) cathode marking 3.0 (0.118) 3.4 (0.134) (2.4) (0.095) 0.1 (0.004) (typ.) 4?1 a c
sfh 4253 2009-08-25 7 empfohlenes l?tpaddesign recommended solder pad design ma?e in mm (inch) / di mensions in mm (inch). ohlpy970 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) cu-area > 16 mm cu-fl?che > 16 mm 2 2 solder resist l?tstopplack 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) padgeometrie fr improved heat dissipation verbesserte w?rmeableitung paddesign for
2009-08-25 8 sfh 4253 l?tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 reflow l?tprofil fr bleifreies l?ten (nach j-std-020c) reflow soldering profile for lead free soldering (acc. to j-std-020c ) wellenl?ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) ohla0687 0 0 t t ?c s 120 s max 50 100 150 200 250 300 ramp up 100 s max 50 100 150 200 250 300 ramp down 6 k/s (max) 3 k/s (max) 25 ?c 30 s max 260 ?c +0 ?c -5 ?c 245 ?c 5 ?c 240 ?c 255 ?c 217 ?c maximum solder profile recommended solder profile 235 ?c -0 ?c +5 ?c minimum solder profile 10 s min ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangskhlung forced cooling normalkurve standard curve grenzkurven limit curves
sfh 4253 2009-08-25 9 published by osram opto semico nductors gmbh leibnizstra?e 4, d-93055 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered.
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